APPLICATIONS
Examples of applications for our products.
Please contact us for more information about other applications.
THERMAL BURN-IN/TEST EQUIPMENT
Our GT-TIM products can successfully be used in thermal burn-in and IC thermal testing equipment.
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LED, CPU, GPU COOLING
LED power dissipation is often very intensive. Our products can be used to effectively dissipate heat from the LED module. Our products are also highly effective in the use of cooling Central processing units (CPUs) and graphics processing units (GPUs).
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IGBT AND OPTOMODULE COOLING
IGBT (Insulated-gate bipolar transistor) and optomodules often require thick and elastic films for cooling under pressure. Which our products can achieve, especially our GT-TIM: GT50 and GT70.
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COOLING OF TEMPORARY FIXED POWER DEVICES
When there is need for sticky, yet easily detachable, properties our best recommendation would be the GT-TIM series and especially the: S-GT10.
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FOR COOLING WITH ELECTRICALLY INSULATING
This often occurs with power RF ad optomodules and sometimes also LED applications. use I-GT10.
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HEAT SPREADING APPLICATIONS
When there is need of uniform and fast heat spreading in x-y plane, our GF product series are highly recommended.
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